Our Capabilities
Our Capabilities
Laser Drilling | Laser Glass Drilling Technologies | Corning
Corning Laser Technologies' laser drilling works for both unstrengthened and strengthened glass, as well as other brittle materials.
Our drilling processes employ ultra-short laser pulses (in the picosecond range) that remove glass through nonlinear effects. The technology can be used to drill glass with extremely low wall taper and little to no micro cracks. Beyond drilling, any geometry can be cut, including cut-outs such as circles or slots, closed-form and radius form factors.
Drilling of Brittle Materials
Corning Laser Technologies' laser drilling works for both unstrengthened and strengthened glass, as well as other brittle materials. The process is clean room compatible, because it generates close to zero material loss and debris.
Laser Processing Systems & Dynatex Tools by Corning Laser Technologies (CLT)
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
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CLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
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CLT 66G
CLT 66G
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
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CLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
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CLT 3D
CLT 3D Laser Cutting Tools
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
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CLT 400S-WD
CLT 400S-WD
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
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Dynatex DTX-200 by CLT - Scribe & Break Tool
Dynatex DTX-200 by Corning Laser Technologies (CLT) - Scribe & Break Tool
Dynatex DTX-200 by Corning Laser Technologies (CLT) - Scribe & Break Tool
Dynatex DTX-200 by Corning Laser Technologies (CLT) - Scribe & Break Tool
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Dynatex DXE Wafer Expander by CLT
Dynatex DXE Wafer Expander by Corning Laser Technologies (CLT)
Dynatex DXE Wafer Expander by Corning Laser Technologies (CLT)
Dynatex DXE Wafer Expander by Corning Laser Technologies (CLT)
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