The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter.  In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.

The FlatMaster MSP provides robust metrology for a variety of applications from complex components and assemblies to transparent materials and wafer metrology.  The FlatMaster MSP-DH is configured to simultaneously measure two sides of a component or assembly providing absolute thickness and parallelism measurements.

The ability to measure flatness, thickness, and thickness variation of 300 millimeter glass and silicon wafers is critical for successful integration of 3DIC assemblies. Traditional contact probes or conventional interferometry systems are too slow or do not have the necessary accuracy for larger fields of view.