It’s clear that Very Small Form Factor (VSFF) connectors will be at the forefront of Hyperscale Data Center design. As AI and machine learning grow in popularity and application, so does the demand for increased power, cooling and high-density connectivity. Corning is deeply embedded with the world’s largest Hyperscale AI-enabling Data Centers, working hand in hand to develop innovations for the future.
The MMC connector type has emerged as a front runner technology in the Hyperscale AI space. Designed by US Conec and integrated into our custom Corning solutions, the MMC is a compact connector (16F and 24F) designed to help data centers quickly expand to accommodate high-bandwidth AI applications.
Why the MMC Connector Works
The DirectConec™ push-pull boot offers a 3x higher cabling port density than MTP® formats, with reliable MT or MT-16 alignment structures. Compatible with standard 250-micron OD and pitch optical fibers, it provides TMT Elite™ low-loss performance and supports APC for single-mode and multimode applications. Available in 16F and 24F variants, it meets Telcordia GR-1435 standards and accommodates cables up to 2.5mm OD, seamlessly integrating with industry-standard infrastructure. View the density improvements in a single 1RU space when utilizing MTPs versus MMCs in the figure below.
