Main Distribution Area​

Multitenant Data Centers (MTDCs), also known as colocations, have many options when deciding how to connect the carriers to the end users. The infrastructure in the main distribution area (MDA) affects the ability to cross-connect and how quick it takes to bring a customer online. All this ultimately affects how quickly the MTDC can turn-up their customers and start making revenue. The Corning Solutions in the MDA enable:
 

• Increased white space for customers by utilizing high-density cable management to reduce the MDA footprint
• Simplified jumper inventory through a single jumper in cross-connect frames
• Lowered risk with universal wiring of preterminated components
• Quicker moves, adds, or changes with complete cable management

Explore our MTDC Spliced or High Density Preterminated Solutions below!

In the MTDC, field termination makes sense when splicers are available and pre-termination is not feasible. Low to high-density solutions are both compatible with a wide variety of field-installable solutions. Field-installable solutions enable:
 

• Simplified ordering, with the splice cassette containing all the parts and materials required to splice
• Flexibility to allow a mixture of both splice and traditional field connectorization in the same housing
• Solutions to balance ease-of-field termination and density to facilitate cross-connects
• Reduced risk of incorrect pre-engineering by terminating jumpers as needed 

For the MTDCs looking to maximize white space and revenue, high-density solutions are the answer. Building out from the meet-me-room to the main distribution area using preterminated solutions allows the MTDC to save on the total cost while also reducing the amount of time it would normally take to bring a customer online. Once a customer comes in, all that is left is the run from the main distribution area to the cage. High-density solutions allow:
 

• Offsetting home run rollouts through smaller harness jumpers in the cage
• Meet SLA by using prebuilt infrastructure to the intermediate distribution frames (IDF) and MTP® or LC assemblies as needed
• Peace of mind knowing that all current and future solutions will be compatible with the EDGE™ housings
• Make the most of the rentable white space by using the high-density solutions